REFLOW SOLDERING PRODUCTS FROM KEY PRODUCTION EQUIPMENT - Reflow Ovens, Cable Preparation, PCB Handling, Drying Ovens, Conveyoring, X-Ray, AOI, Stencil Cleaning, Dispensing, PCB Assembly, Solder Recovery, Dispensing Equipment, Cable Handling, Component Assembly, Conveyor Systems, Printed Circuit Board assembly, Pick and Place, Automatic Optical Inspection, Screen Printers

KPE Ltd can supply a full range of reflow ovens working as the UK distributor of BTU and Essemtec. Full force convection reflow ovens with low mass heating provide a fast response to any temperature change, lead free capability is a standard. A controlled and balanced air flow across and along the length of each heating zone assists to achieve the lowest delta T. Transportation of the circuit board can be on a mesh belt or pin chain conveyor. The number of zones required is often defined by the type of product and the beat rate of the production line.

BTU Pyramax Convection Reflow Oven

BTU Pyramax Reflow

BTU Pyramax Convection Reflow Oven

BTU’s Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10 and new 12-zone air or nitrogen models, 350 degrees maximum temperature and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.

• Lead Free Process-Guaranteed

• Programmable Heating and Cooling Rates

• BTU Quality and Reliability

• Lifetime warranty on heaters and blowers

• 6, 8, 10 or 12 Zones available

Versatile reflow oven for medium volume soldering

RO400FC

Full Convection Reflow Oven

Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards.

• Stand alone or inline reflow

• Full force convection

• Lead free capacity

• Heated length 1680mm

• Large air volume

• Proven process

• Low mass fast response

• Process width 400mm

Refurbished RO300FC Full Convection Reflow Oven

Refurbished RO300FC

Full Convection Reflow Oven

Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m.

• Full force convection

• Lead free capacity

• Large air volume

• Proven process

• Low mass fast response

• Process width 300mm

• Equal heating rates

• Minimum Delta-T

• Precise temperature control

Reflow Soldering

Here is a small selection of
Reflow Soldering products available from Essemtec and Vantage. If you require information or details on any other systems which may suit your requirements better please contact us.

Key Production Equipment supply a range from the
smallest Benchtop oven through to the pass through ovens ranging from 3 heating zones to 12 zones. Ovens can be configured with Flux management, nitrogen and on board profiling as required.

Contact us at KPE Ltd